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Through hole and SMD

Through-hole technology, also spelled “thru-hole”, refers to the mounting scheme used for electronic

Metal Core PCB & LED Assemblies

Base metals in the MCPCB are used as an alternative to FR4 or CEM3 boards for the ability to dissipate heat

LED driver design & manufacturing

This is where high-quality LEDs paired with good thermal management and robust

Ball Grid Array Assembly

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits

The mechanics of EMS industry is simple. The real prime movers are the people & Processes :

“Their motivation and direction.”

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